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Fine-pitch dense die assembly process with only a single adhesive application without pressure, without underfill, without fine patterning, without complex alignment vs solder ball-to-solder pad, etc? This article will outline the developments of this technology and show examples of this magnetically aligned Anisotropic Conductive Epoxy packaging method used on various substrates. Progress will be shared for dense and fine pitch Land Grid Arrays (LGA) on a semi-rigid interposer. Check out the fu
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